DocumentCode
3664675
Title
Material and device performance of TiO2 doped GeTe for ruggedized memory applications
Author
E. K. Chua;M. H. Li;K. G. Lim;C. C. Yeap;L. T. Law;W. J. Wang;E. G. Yeo;F. Ernult
Author_Institution
Data Storage Institute, (A∗
fYear
2015
fDate
6/1/2015 12:00:00 AM
Firstpage
162
Lastpage
165
Abstract
GeTe phase change material doped with 12 to 22 atomic percent TiO2 were deposited and characterized. The crystallization of amorphous doped GeTe is inhibited by the incorporation of TiO2 dopant up to 22 % as depicted by the increasing activation energy. However, only working devices fabricated using 12% of TiO2 dopant with activation energy of 4.24 eV and crystallization temperature of 210 °C was compared with GeTe. Doped GeTe devices achieved power reduction of 79 % as compared to GeTe devices, operated at 150 °C and achieved endurance of 5×104 cycles.
Keywords
"Temperature measurement","Thermal stability","Resistance","Crystallization","Doping","Electrical resistance measurement","Voltage measurement"
Publisher
ieee
Conference_Titel
Electron Devices and Solid-State Circuits (EDSSC), 2015 IEEE International Conference on
Print_ISBN
978-1-4799-8362-9
Type
conf
DOI
10.1109/EDSSC.2015.7285075
Filename
7285075
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