DocumentCode
3667939
Title
Hierarchical TCAD device simulation of FinFETs
Author
M. Karner;Z. Stanojević;C. Kernstock;H.W. Cheng-Karner;O. Baumgartner
Author_Institution
Global TCAD Solutions GmbH, Landhausgasse 4/1A, 1010 Wien, Austria
fYear
2015
Firstpage
258
Lastpage
261
Abstract
A framework for FinFET design studies is presented. Our physics-based modeling approach allows to accurately capture the effects of channel cross-section, orientation and strain as well as contact resistance - for the first time all in one tool. Using this approach as a reference, the predictiveness of empirical TCAD models is extended by re-calibration. Our hierarchical tool chain is embedded in an industry-proven framework equipped with DOE and optimization modules. The capabilities are demonstrated in a simulation study on a recent FinFET technology node.
Keywords
"Mathematical model","Computational modeling","Semiconductor process modeling","Optimization","Predictive models","FinFETs","Stress"
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices (SISPAD), 2015 International Conference on
ISSN
1946-1569
Print_ISBN
978-1-4673-7858-1
Type
conf
DOI
10.1109/SISPAD.2015.7292308
Filename
7292308
Link To Document