• DocumentCode
    3667939
  • Title

    Hierarchical TCAD device simulation of FinFETs

  • Author

    M. Karner;Z. Stanojević;C. Kernstock;H.W. Cheng-Karner;O. Baumgartner

  • Author_Institution
    Global TCAD Solutions GmbH, Landhausgasse 4/1A, 1010 Wien, Austria
  • fYear
    2015
  • Firstpage
    258
  • Lastpage
    261
  • Abstract
    A framework for FinFET design studies is presented. Our physics-based modeling approach allows to accurately capture the effects of channel cross-section, orientation and strain as well as contact resistance - for the first time all in one tool. Using this approach as a reference, the predictiveness of empirical TCAD models is extended by re-calibration. Our hierarchical tool chain is embedded in an industry-proven framework equipped with DOE and optimization modules. The capabilities are demonstrated in a simulation study on a recent FinFET technology node.
  • Keywords
    "Mathematical model","Computational modeling","Semiconductor process modeling","Optimization","Predictive models","FinFETs","Stress"
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2015 International Conference on
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4673-7858-1
  • Type

    conf

  • DOI
    10.1109/SISPAD.2015.7292308
  • Filename
    7292308