DocumentCode :
3667959
Title :
Advanced TCAD simulation of local mismatch in 14nm CMOS technology FinFETs
Author :
E. M. Bazizi;I. Chakarov;T. Herrmann;A. Zaka;L. Jiang;X. Wu;S. M. Pandey;F. Benistant;D. Reid;A. R. Brown;C. Alexander;C. Millar;A. Asenov
Author_Institution :
GLOBALFOUNDRIES, Dresden, Germany
fYear :
2015
Firstpage :
341
Lastpage :
344
Abstract :
Local statistical variability (mismatch) is very important in advanced CMOS technologies critically affecting, among others, SRAM supply and holding voltages, performance and yield. TCAD simulation of statistical variability is essential for identification of variability sources and their control in the technology development and optimization. It also plays an important role in the development of accurate statistical compact models for SRAM design, statistical standard cell characterization and statistical circuit simulation and verification. In this paper we compare the TCAD simulation results of statistical variability in 14nm CMOS FinFET technology with Silicon measurements in order to understand the relative role of key statistical variability sources, to assist the technology optimization and to generate target characteristics for statistical compact model extraction.
Keywords :
"Semiconductor process modeling","FinFETs","Solid modeling","Integrated circuit modeling","Random access memory","Logic gates","Three-dimensional displays"
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2015 International Conference on
ISSN :
1946-1569
Print_ISBN :
978-1-4673-7858-1
Type :
conf
DOI :
10.1109/SISPAD.2015.7292329
Filename :
7292329
Link To Document :
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