DocumentCode :
3667966
Title :
Layout-induced stress effects on the performance and variation of FinFETs
Author :
Choongmok Lee;Hyun-Chul Kang;Jeong Guk Min;Jongchol Kim;Uihui Kwon;Keun-Ho Lee;Youngkwan Park
Author_Institution :
CAE, R&
fYear :
2015
Firstpage :
369
Lastpage :
372
Abstract :
Recently, LLEs(Local Layout Effects) and their impact on performance due to STI stressor and eSiGe S/D have been reported in FinFETs[1]. However, the impacts of gate and contact stress are rarely demonstrated. In this paper, we extended the LLE factors to the gate and contact and analyzed their impact on the electrical parameters of mobility, IdSat and VtSat via TCAD simulation study. This work shows that 5(20)% of n(p)FET performance enhancement and only 1(2)% of IdSat variation can be obtained through optimal stress components aligned with LLE factors.
Keywords :
"Diffusion tensor imaging","Logic gates","Performance evaluation","Semiconductor process modeling","Tensile stress","Layout"
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2015 International Conference on
ISSN :
1946-1569
Print_ISBN :
978-1-4673-7858-1
Type :
conf
DOI :
10.1109/SISPAD.2015.7292336
Filename :
7292336
Link To Document :
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