• DocumentCode
    3669889
  • Title

    Formation mechanism of space charge in silicone rubber insulation under low DC stress

  • Author

    X. Wang;C. Chen;J.Z. Xiong;Kai Wu;D.M. Tu

  • Author_Institution
    State Key Laboratory of Electrical Insulation and Power Equipment, Xi´an Jiaotong University, 710049, China
  • fYear
    2015
  • fDate
    7/1/2015 12:00:00 AM
  • Firstpage
    116
  • Lastpage
    119
  • Abstract
    The study of production, transfer and accumulation of space charge in silicon rubber (SIR) under direct current (DC) is significant for the research of new high voltage (HV) DC cable accessories and the accessories´ stable operation. In this paper, based on SIR materials used for cable accessories and the actual low working stress, the accumulation of space charges in SIR was measured under low DC stresses (6-15kV/mm), different temperatures (room temperature and the 40? temperature difference) and different applied voltage patterns (independent voltage and stepped voltage). The results show that the major polarization type in SIR is the dipole´s steering polarization when the voltage is applied. Moreover the higher the applied stress the stronger the dipole´s polarization. As a result, the amount of charges near the electrode is reduced. Besides, the form of injection channel under the step voltage indicates the presence of large numbers of deep traps in SIR, the deep traps are easy to trap charges and to form conductive channels. The channels are helpful for migration and dissipation of local injected charges. In addition, Temperature gradient facilitates to enhance charge injection from high temperature electrode, weaken dipole moment and lead to more injected charges in SIR bulk.
  • Keywords
    "Stress","Temperature measurement","Space charge","Electrodes","Semiconductor device measurement","Temperature","Voltage measurement"
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials (ICPADM), 2015 IEEE 11th International Conference on the
  • Electronic_ISBN
    2160-9241
  • Type

    conf

  • DOI
    10.1109/ICPADM.2015.7295222
  • Filename
    7295222