• DocumentCode
    3670068
  • Title

    Electronic relaxation of deep bulk trap in CaCu3Ti4O12 ceramics: Post-annealing studies

  • Author

    Ran Jia;Jianying Li;Linlin Hou;Huan Li

  • Author_Institution
    State Key Laboratory of Electrical Insulation and Power Equipment, Xi´an Jiaotong University, 710049, China
  • fYear
    2015
  • fDate
    7/1/2015 12:00:00 AM
  • Firstpage
    836
  • Lastpage
    839
  • Abstract
    The influence of annealing after sintering on the non-ohmic and dielectric behavior of CaCu3Ti4O12 ceramics was investigated from -140 to 200 °C. Sintering at 1080 °C was followed by a cooling rate of 2.5 °C/min and quenching to ambient temperature for comparison. And both ceramic samples were annealed in flowing O2, then N2 and O2 again at 950 °C. It was found that annealing in O2 can reduce dielectric loss and enhance non-ohmic behavior of the quenched sample, while dielectric loss rose back up again after annealing in N2. On the contrary, the slow cooled sample showed low dielectric loss, analogous to annealing in O2. Trapped electron relaxation processes caused by Vo+ and V0++ in the depletion layer of Schottky barrier can be identified, and the energy levels were deduced to 0.10 eV and 0.49 eV respectively. A relaxation with an energy level of 0.66 eV was detected in slowly cooled sample, which can be eliminated by annealing in N2 and then re-created by annealing in O2. This energy level was proposed to relate with the additional interface states caused by oxygen adsorption along the interface. Introducing more electronegative defects at boundaries was supposed as a promising solution to promote the application of CCTO as non-ohmic device with low dielectric loss.
  • Keywords
    "Annealing","Ceramics","Grain boundaries","Dielectric losses","Dielectric constant","Schottky barriers"
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials (ICPADM), 2015 IEEE 11th International Conference on the
  • Electronic_ISBN
    2160-9241
  • Type

    conf

  • DOI
    10.1109/ICPADM.2015.7295402
  • Filename
    7295402