• DocumentCode
    3671020
  • Title

    Fast and accurate electro-thermal behavioral model of a commercial SiC 1200V, 80 mΩ power MOSFET

  • Author

    Bejoy N. Pushpakaran;Stephen B. Bayne;Gangyao Wang;John Mookken

  • Author_Institution
    Electrical and Computer Engineering, Texas Tech University, Lubbock, TX 79409 USA, Power Applications, Cree Inc., Durham, NC 27703 USA
  • fYear
    2015
  • fDate
    5/1/2015 12:00:00 AM
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    The superior electro-thermal properties of Silicon Carbide (SiC) as compared to silicon make them a viable candidate for high voltage and high frequency applications. Due to the relatively recent surge in commercially available SiC power MOSFETs, there is an immediate demand for accurate simulations models to predict device behavior and aid circuit design process. This paper discusses the development of an accurate SPICE based model for a commercially available 1200V, 20A SiC power MOSFET manufactured by CREE Inc. based on the Enz - Krummenacher - Vittoz (EKV) MOSFET model. The advantage of using EKV model over the simplified quadratic model is the ability to characterize MOSFET behavior over weak, moderate and strong inversion regions with a single equation. The model was developed using parameters extracted through experimental data conducted at wide temperature range. Package parasitic components have been incorporated into the model to predict device behavior in high frequency switching applications. The model was simulated for its static and transient behavior and compared with actual device results to determine accuracy over a wide operating range.
  • Keywords
    "Mathematical model","Semiconductor device modeling","MOSFET","Silicon carbide","Integrated circuit modeling","SPICE","Logic gates"
  • Publisher
    ieee
  • Conference_Titel
    Pulsed Power Conference (PPC), 2015 IEEE
  • ISSN
    2158-4915
  • Electronic_ISBN
    2158-4923
  • Type

    conf

  • DOI
    10.1109/PPC.2015.7296918
  • Filename
    7296918