DocumentCode :
3673380
Title :
Event-based thermal control for high-density processors
Author :
Alberto Leva;Federico Terraneo;William Fornaciari
Author_Institution :
Dipartimento di Elettronica, Informazione e Bioingegneria, Politecnico di Milano, Piazza Leonardo da Vinci, 32 - 20133, Italy
fYear :
2015
fDate :
6/1/2015 12:00:00 AM
Firstpage :
1
Lastpage :
8
Abstract :
The increasing computational density of modern processors, and the advent of 3D chip layouts, are making thermal control a requirement, often crucial for the life itself of the device. In demanding applications, traditional on/off control solutions - based e.g. on clock gating - cannot deliver the required regulation quality if not unacceptably reducing the computational performance of the system, while schemes based on modulating control require so fast sampling rates to cause an equally unacceptable overhead. In this paper we present an event-based thermal control scheme, capable of guaranteeing safe operation with a low effort. We also show how the proposed solution can be divided into a hardware and a software part, further improving efficiency. The claims above are supported by cycle-accurate simulations on a literature benchmark.
Keywords :
"Temperature control","Object oriented modeling","Hardware","Thermal management","Libraries","Program processors"
Publisher :
ieee
Conference_Titel :
Event-based Control, Communication, and Signal Processing (EBCCSP), 2015 International Conference on
Type :
conf
DOI :
10.1109/EBCCSP.2015.7300685
Filename :
7300685
Link To Document :
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