Enhancement of terahertz imaging of packaged power electronic devices

Nondestructive imaging of packaged silicon carbide power transistors was performed using terahertz (THz) time-domain reflection imaging. Techniques were developed to process the data gathered by these measurements and enhance the quality of the THz time-domain images. It was found that applying high-pass error function filters in the frequency domain provided the best balance of improving image clarity and minimizing distortion of the time-domain signal. The results indicate that with proper data processing, THz imaging can be a viable nondestructive method for inspecting packaged power electronic devices.