Title :
High frequency characterization of conductive inks embedded within a structural composite
Author :
Peter Pa;Mark S. Mirotznik;Shridhar Yarlaggada
Author_Institution :
Electrical and Computer Engineering Dept., University of Delaware, Newark, 19716, USA
fDate :
7/1/2015 12:00:00 AM
Abstract :
Woven fabric composites provide an attractive platform for integrating electromagnetic functionality, such as conformal load bearing antennas and frequency selective surfaces, into a structural platform. A practical fabrication method for integrating conductive elements within a woven fabric composite system is the use of additive manufacturing systems such as screen printing. While screen printing is an inherently scalable, flexible and cost effective method there is little known about the high frequency electrical properties of conductive inks when embedded within a woven fabric structural composite. In this paper we report results from a numerical and experimental study to determine the electrical conductivity of screen printable conductive inks embedded within a structural composite laminate.
Keywords :
"Conductivity","Microstrip","Ink","Silver","Transmission line measurements","Fabrics","Copper"
Conference_Titel :
Antennas and Propagation & USNC/URSI National Radio Science Meeting, 2015 IEEE International Symposium on
DOI :
10.1109/APS.2015.7305044