Wireless interconnects for 3D Network-on-Chip with embedded micro thermofluidic cooling channels

This work presents the design of wireless interconnects to provide a dynamic reconfiguring of a Networkon-a-Chip (WNoC) that responds to various demands such as thermal emergencies. The architecture is a novel 3D chip layering, with embedded micro cooling channels. Zigzag antennas are placed on the SiO₂ layers, above and below the cooling channel and individually tuned, using HFSS, for return loss (RL) less than ™10dB at 60 GHz. The cooling layers are modeled as dielectric tubes with ε_r=1.75. The transmission coefficient between antennas demonstrates the feasibility of low power communication. It is also shown that at frequencies less than 10 GHz, there is no resonance for the antennas ensuring that there is no interference with the clock signals.