DocumentCode :
3676742
Title :
Wireless interconnects for 3D Network-on-Chip with embedded micro thermofluidic cooling channels
Author :
Christopher Caporale;Jayanti Venkataraman
Author_Institution :
Department of Electrical and Microelectronic Engineering, Rochester Institute of Technology (RIT), NY, 14623, USA
fYear :
2015
fDate :
7/1/2015 12:00:00 AM
Firstpage :
1454
Lastpage :
1455
Abstract :
This work presents the design of wireless interconnects to provide a dynamic reconfiguring of a Networkon-a-Chip (WNoC) that responds to various demands such as thermal emergencies. The architecture is a novel 3D chip layering, with embedded micro cooling channels. Zigzag antennas are placed on the SiO2 layers, above and below the cooling channel and individually tuned, using HFSS, for return loss (RL) less than ™10dB at 60 GHz. The cooling layers are modeled as dielectric tubes with εr=1.75. The transmission coefficient between antennas demonstrates the feasibility of low power communication. It is also shown that at frequencies less than 10 GHz, there is no resonance for the antennas ensuring that there is no interference with the clock signals.
Keywords :
"Cooling","Transmitting antennas","Three-dimensional displays","Wireless communication","Resonant frequency","Interference"
Publisher :
ieee
Conference_Titel :
Antennas and Propagation & USNC/URSI National Radio Science Meeting, 2015 IEEE International Symposium on
Type :
conf
DOI :
10.1109/APS.2015.7305116
Filename :
7305116
Link To Document :
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