• DocumentCode
    3679115
  • Title

    Enabling Scaling of Advanced CMOS Technologies: A Reliability Perspective

  • Author

    Tanya Nigam;Andreas Kerber

  • Author_Institution
    GLOBALFOUNDRIES, Santa Clara, CA, USA
  • fYear
    2015
  • fDate
    7/1/2015 12:00:00 AM
  • Firstpage
    199
  • Lastpage
    199
  • Abstract
    As CMOS technologies continue to scale and devices become more interconnected, new reliability challenges are emerging. With Internet-of-Things, semiconductor devices will be ubiquitous and used under diverse environmental conditions. In this paper we will review the device level scaling challenges from the reliability perspective, which include new materials, variability in ever decreasing dimensions, and methodology enhancements needed to provide reliable solutions across different product segments. The critical need for product level reliability assessment will be highlighted to provide additional margin for the consumer market.
  • Keywords
    "Materials reliability","Dielectrics","Random access memory","Logic gates","CMOS integrated circuits","CMOS technology"
  • Publisher
    ieee
  • Conference_Titel
    VLSI (ISVLSI), 2015 IEEE Computer Society Annual Symposium on
  • Type

    conf

  • DOI
    10.1109/ISVLSI.2015.120
  • Filename
    7309564