DocumentCode
3679115
Title
Enabling Scaling of Advanced CMOS Technologies: A Reliability Perspective
Author
Tanya Nigam;Andreas Kerber
Author_Institution
GLOBALFOUNDRIES, Santa Clara, CA, USA
fYear
2015
fDate
7/1/2015 12:00:00 AM
Firstpage
199
Lastpage
199
Abstract
As CMOS technologies continue to scale and devices become more interconnected, new reliability challenges are emerging. With Internet-of-Things, semiconductor devices will be ubiquitous and used under diverse environmental conditions. In this paper we will review the device level scaling challenges from the reliability perspective, which include new materials, variability in ever decreasing dimensions, and methodology enhancements needed to provide reliable solutions across different product segments. The critical need for product level reliability assessment will be highlighted to provide additional margin for the consumer market.
Keywords
"Materials reliability","Dielectrics","Random access memory","Logic gates","CMOS integrated circuits","CMOS technology"
Publisher
ieee
Conference_Titel
VLSI (ISVLSI), 2015 IEEE Computer Society Annual Symposium on
Type
conf
DOI
10.1109/ISVLSI.2015.120
Filename
7309564
Link To Document