• DocumentCode
    3682740
  • Title

    A prognostics and health management method for instrumentation system remanufacturing

  • Author

    Kai Wang;Aidong Xu;Jing Tian;Michael Pecht

  • Author_Institution
    Laboratory of Networked Control Systems, Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang, China
  • fYear
    2015
  • fDate
    7/1/2015 12:00:00 AM
  • Firstpage
    63
  • Lastpage
    66
  • Abstract
    Remanufacturing can effectively help reduce the environmental burden considering that it reduces both the natural resources needed and the waste produced. Currently, remanufacturing has been widely applied in the process instrumentation industry. Considering that the instrumentation makes up the brain of a process operation, how to remanufacture instrumentation plays a decisive role in the safety and economy of a plant. However, challenges such as what is the best time to performing remanufacturing and what components should be replaced, are still not being addressed because the remanufacturing decision-making method is missing. Therefore, a prognostics and health management (PHM)-based method is proposed for instrumentation system remanufacturing in this paper. First, different categories of components are identified for in-situ monitoring using failure modes, mechanisms, and effects analysis (FMMEA). Then, a system-level performance index (PI) for each component is calculated based on the PHM techniques. Finally, the component health index for each component is achieved based on the corresponding system-level PI by an application-specific mapping model. The remaining useful life of the instrumentation can be optimally used, and thus the cost of remanufacturing can be minimized by using the method proposed.
  • Keywords
    "Instruments","Prognostics and health management","Temperature sensors","Monitoring","Temperature measurement","Reliability","Circuit faults"
  • Publisher
    ieee
  • Conference_Titel
    Technologies for Sustainability (SusTech), 2015 IEEE Conference on
  • Type

    conf

  • DOI
    10.1109/SusTech.2015.7314323
  • Filename
    7314323