• DocumentCode
    3682741
  • Title

    Sustainability in printed circuit board manufacturing decreasing waste using additive technology

  • Author

    Reza Kamali-Sarvestani;Ephraim Nielson;Paul Weber

  • Author_Institution
    Department of Computer Science and Engineering, Utah Valley University, Orem, Utah
  • fYear
    2015
  • fDate
    7/1/2015 12:00:00 AM
  • Firstpage
    67
  • Lastpage
    72
  • Abstract
    A recent method for printed circuit board technology is studied, which greatly reduces the amount of metallic and chemical waste by using an additive technology, as opposed to traditional processes based on subtractive technology which require the use of large amounts of acids and toxic solvents. We examined the eSurfaceTM process for electroless plating, by fabricating samples from various materials and studying the quality of the deposited patterns. The results show a significant decrease in the use of chemicals, a reduction in the amount of procedures necessary for printed circuit board manufacturing, and an elimination of solvents and etching materials typically used in PCB manufacturing.
  • Keywords
    "Copper","Manufacturing","Chemicals","Metallization","Surface treatment","Plating","Resists"
  • Publisher
    ieee
  • Conference_Titel
    Technologies for Sustainability (SusTech), 2015 IEEE Conference on
  • Type

    conf

  • DOI
    10.1109/SusTech.2015.7314324
  • Filename
    7314324