DocumentCode :
3682741
Title :
Sustainability in printed circuit board manufacturing decreasing waste using additive technology
Author :
Reza Kamali-Sarvestani;Ephraim Nielson;Paul Weber
Author_Institution :
Department of Computer Science and Engineering, Utah Valley University, Orem, Utah
fYear :
2015
fDate :
7/1/2015 12:00:00 AM
Firstpage :
67
Lastpage :
72
Abstract :
A recent method for printed circuit board technology is studied, which greatly reduces the amount of metallic and chemical waste by using an additive technology, as opposed to traditional processes based on subtractive technology which require the use of large amounts of acids and toxic solvents. We examined the eSurfaceTM process for electroless plating, by fabricating samples from various materials and studying the quality of the deposited patterns. The results show a significant decrease in the use of chemicals, a reduction in the amount of procedures necessary for printed circuit board manufacturing, and an elimination of solvents and etching materials typically used in PCB manufacturing.
Keywords :
"Copper","Manufacturing","Chemicals","Metallization","Surface treatment","Plating","Resists"
Publisher :
ieee
Conference_Titel :
Technologies for Sustainability (SusTech), 2015 IEEE Conference on
Type :
conf
DOI :
10.1109/SusTech.2015.7314324
Filename :
7314324
Link To Document :
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