DocumentCode
3682888
Title
Current Status of Gallium Oxide-Based Power Device Technology
Author
Masataka Higashiwaki;Kohei Sasaki;Man Hoi Wong;Takafumi Kamimura;Ken Goto;Kazushiro Nomura;Quang Tu Thieu;Rie Togashi;Hisashi Murakami;Yoshinao Kumagai;Bo Monemar;Akinori Koukitu;Akito Kuramata;Takekazu Masui;Shigenobu Yamakoshi
Author_Institution
Nat. Inst. of Inf. &
fYear
2015
Firstpage
1
Lastpage
4
Abstract
Gallium oxide (Ga2O3) possesses excellent material properties especially for power device applications. It is also attractive from an industrial viewpoint since large-size, high-quality wafers can be manufactured by using simple methods. These two features have drawn much attention to Ga2O3 as a new wide bandgap semiconductor following SiC and GaN. In this report, we describe the recent progress in development on fundamental technologies for Ga2O3 devices, covering wafer production from melt-grown bulk single crystals, homoepitaxial thin-film growth by halide vapor phase epitaxy, as well as device processing and characterization of metal-oxide-semiconductor field-effect transistors and Schottky barrier diodes.
Publisher
ieee
Conference_Titel
Compound Semiconductor Integrated Circuit Symposium (CSICS), 2015 IEEE
Type
conf
DOI
10.1109/CSICS.2015.7314495
Filename
7314495
Link To Document