• DocumentCode
    3682888
  • Title

    Current Status of Gallium Oxide-Based Power Device Technology

  • Author

    Masataka Higashiwaki;Kohei Sasaki;Man Hoi Wong;Takafumi Kamimura;Ken Goto;Kazushiro Nomura;Quang Tu Thieu;Rie Togashi;Hisashi Murakami;Yoshinao Kumagai;Bo Monemar;Akinori Koukitu;Akito Kuramata;Takekazu Masui;Shigenobu Yamakoshi

  • Author_Institution
    Nat. Inst. of Inf. &
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Gallium oxide (Ga2O3) possesses excellent material properties especially for power device applications. It is also attractive from an industrial viewpoint since large-size, high-quality wafers can be manufactured by using simple methods. These two features have drawn much attention to Ga2O3 as a new wide bandgap semiconductor following SiC and GaN. In this report, we describe the recent progress in development on fundamental technologies for Ga2O3 devices, covering wafer production from melt-grown bulk single crystals, homoepitaxial thin-film growth by halide vapor phase epitaxy, as well as device processing and characterization of metal-oxide-semiconductor field-effect transistors and Schottky barrier diodes.
  • Publisher
    ieee
  • Conference_Titel
    Compound Semiconductor Integrated Circuit Symposium (CSICS), 2015 IEEE
  • Type

    conf

  • DOI
    10.1109/CSICS.2015.7314495
  • Filename
    7314495