Sub-Micron Thermal Imaging Characterization of GaN HEMT and MMIC Devices

Thermoreflectance imaging provides sub-micron spatial resolution with transient capability for thermal imaging of advanced semiconductor devices. Today´s RF transistors and microwave devices, however, have presented significant optical challenges. This paper describes the equipment for achieving sub-micron resolution and includes thermal imaging examples for GaN HEMT devices and MMICs, followed by methods used to adapt the multi surface optical properties due to the geometrical complexity of integrated devices, such as a MMIC, and the thermal spatial drift due to thermal expansion.