DocumentCode :
3683149
Title :
A study of the effect of remote CDM clamps in integrated circuits
Author :
Dolphin Abessolo-Bidzo;Theo Smedes;Peter C. de Jong
Author_Institution :
NXP Semiconductors, Gerstweg 2, 6534 AE Nijmegen, the Netherlands
fYear :
2015
Firstpage :
1
Lastpage :
8
Abstract :
Cross-domain signals are the largest ESD risk in integrated circuits nowadays. In this paper, a study of the effect of remote CDM clamps in IC´s is presented. Predictive ESD simulations are demonstrated by TLP and vf-TLP characterizations and by means of HBM and CDM qualifications of a dedicated ESD testchip.
Keywords :
"Electrostatic discharges","Clamps","Integrated circuit modeling","Logic gates","Receivers","Substrates"
Publisher :
ieee
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2015 37th
Type :
conf
DOI :
10.1109/EOSESD.2015.7314787
Filename :
7314787
Link To Document :
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