• DocumentCode
    3688087
  • Title

    Silicon photonics packaging on board-level

  • Author

    Lars Brusberg;Daniel Weber;Dominik Pernthaler;Biswajit Mukhopadhyay;Gunnar Bottger;Henning Schroder;Tolga Tekin

  • Author_Institution
    Fraunhofer Inst. for Reliability &
  • fYear
    2015
  • Firstpage
    474
  • Lastpage
    475
  • Abstract
    The ongoing development focuses on low-loss single-mode glass waveguide panel integration in multi-layer electro-optical circuit boards (EOCB) and optical interconnection by micro-optics to the grating couplers of such assembled silicon photonic chips.
  • Keywords
    Position measurement
  • Publisher
    ieee
  • Conference_Titel
    Photonics Conference (IPC), 2015
  • ISSN
    1092-8081
  • Type

    conf

  • DOI
    10.1109/IPCon.2015.7323521
  • Filename
    7323521
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3688087