• DocumentCode
    3688145
  • Title

    Comparison of the 2D and 3D integrated circuit fabrication process for visible imaging SPAD arrays

  • Author

    Valerian Lalucaa;Philippe Martin-Gonthier;Pierre Magnan

  • Author_Institution
    University of Toulouse, ISAE, Image sensor research team, 31055 France
  • fYear
    2015
  • Firstpage
    442
  • Lastpage
    443
  • Abstract
    SPAD arrays for visible imaging are analyzed in order to assess the gain of performances with a 3D integration process. A practical example is given with the available design kit of a two layer technology.
  • Keywords
    "Three-dimensional displays","Photonics","CMOS integrated circuits","Integrated circuit interconnections","Imaging","CMOS technology","Substrates"
  • Publisher
    ieee
  • Conference_Titel
    Photonics Conference (IPC), 2015
  • ISSN
    1092-8081
  • Type

    conf

  • DOI
    10.1109/IPCon.2015.7323586
  • Filename
    7323586
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3688145