Title :
Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Extending the capabilities of the silicon photonic platform
Author :
C. Koos;W. Freude;J. Leuthold;M. Kohl;L. R. Dalton;W. Bogaerts;M. Lauermann;S. Wolf;C. Weimann;A. Melikyan;N. Lindenmann;M. R. Billah;S. Muehlbrandt;S. Koeber;R. Palmer;K. Koehnle;L. Alloatti;D. L. Elder;A.-L. Giesecke;T. Wahlbrink
Author_Institution :
Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), 76131, Germany
Abstract :
Limitations of silicon photonics can be overcome by hybrid integration or by photonic multi-chip systems. We give an overview on recent progress regarding silicon-organic hybrid (SOH) integration as well as multi-chip integration enabled by photonic wire bonding.
Keywords :
"Silicon photonics","Wires","Bonding","Optical device fabrication","Optical modulation"
Conference_Titel :
Photonics Conference (IPC), 2015
DOI :
10.1109/IPCon.2015.7323735
