DocumentCode :
3688979
Title :
Charge trapping in gate-drain access region of AlGaN/GaN MIS-HEMTs after drain stress
Author :
S. A. Jauss;S. Schwaiger;W. Daves;S. Noll;O. Ambacher
Author_Institution :
Robert Bosch GmbH, Robert-Bosch-Campus 1, 70839 Gerlingen, Germany
fYear :
2015
Firstpage :
56
Lastpage :
59
Abstract :
In this paper we investigate the drain stress behavior and charge trapping phenomena of GaN-based high electron mobility transistors (HEMTs). We fabricated GaN-on-Si MIS-HEMTs with different dielectric stacks in the gate and gate drain access region and performed interface characterization and stress measurements for slow traps analysis. Our results show a high dependency of the on-resistance increase on interfaces in the gate-drain access region. The dielectric interfaces near the channel play a significant role for long term high voltage stress and regeneration of the device.
Keywords :
"Logic gates","Silicon compounds","Gallium nitride","Stress","Aluminum gallium nitride","Wide band gap semiconductors","Dielectrics"
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference (ESSDERC), 2015 45th European
ISSN :
1930-8876
Print_ISBN :
978-1-4673-7133-9
Electronic_ISBN :
2378-6558
Type :
conf
DOI :
10.1109/ESSDERC.2015.7324712
Filename :
7324712
Link To Document :
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