Simulation of a novel flip-chip antenna in THz region

In this paper, issues a novel Flip-chip (FC) package model simulation of THz on a chip integrated antenna. Log periodic antenna is designed on a GaAs substrate, with a thickness of 100 μm. An air bridge of Schottky Diode located at the center of the antenna is protected by using thin-film ceramic layer for supporting layer. About 200 μm diameter Au pad on GaAs substrate is connected to the PCB board via thin-film ceramic layer. There is an air chamber underneath the antenna to improve antenna performance and mitigate multilayer structure influence the near filed of antenna. The FC package mode cause simulation results performance to deteriorate. Nevertheless, good performance has been obtained up to around 0.25-0.34 THz (λ=1200μm-880μm). Thus, FC processing with thin-film ceramic layer has been proven to be one solution for THz region antenna package. Which can give simplicity and possibility of designing large format arrays on a direct detection or heterodyne detection THz system.