Title :
Modeling of TSV-based solenoid inductors for 3-D integration
Author :
Jie Zheng;Da-Wei Wang;Wen-Sheng Zhao;Gaofeng Wang;Wen-Yan Yin
Author_Institution :
Key Lab of RF Circuits and Systems of Ministry of Education, Microelectronics CAD Center, Hangzhou Dianzi University, Hangzhou 310018, China
fDate :
7/1/2015 12:00:00 AM
Abstract :
Circuit model for TSV-based solenoid inductors is presented and investigated. Based on the measurement, the related lumped circuit elements can be extracted, and they are independent of the operating frequency by virtue of the RL ladder. Hence, the circuit model is compatible with the SPICE simulators. Based on the circuit model, the impacts of design parameters on the quality factor and inductance are studied. Finally, the frequency-thermal analysis of TSV-based solenoid inductors is carried out.
Keywords :
"Inductors","Solenoids","Yttrium","Integrated circuit modeling","Q-factor","Inductance","Silicon"
Conference_Titel :
Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 2015 IEEE MTT-S International Microwave Workshop Series on
DOI :
10.1109/IMWS-AMP.2015.7324959
