• DocumentCode
    3689338
  • Title

    User association and the alignment-throughput tradeoff in millimeter wave networks

  • Author

    Hossein Shokri-Ghadikolaei;Yuzhe Xu;Lazaros Gkatzikis;Carlo Fischione

  • Author_Institution
    Electrical Engineering, KTH Royal Institute of Technology, 100 44, Stockholm, Sweden
  • fYear
    2015
  • Firstpage
    100
  • Lastpage
    105
  • Abstract
    Millimeter wave (mmWave) communication is a promising candidate for future extremely high data rate, wireless networks. The main challenges of mmWave communications are deafness (misalignment between the beams of the transmitter and receiver) and blockage (severe attenuation due to obstacles). Due to deafness, prior to link establishment between a client and its access point, a time consuming alignment/beam training procedure is necessary, whose complexity depends on the operating beamwidth. Addressing blockage may require a reassociation to non-blocked access points, which in turn imposes additional alignment overhead. This paper introduces a unifying framework to maximize network throughput considering both deafness and blockage. A distributed auction-based solution is proposed, where the clients and access points act asynchronously to achieve optimal association along with the optimal operating beamwidth. It is shown that the proposed algorithm provably converges to a solution that maximizes the aggregate network utility within a desired bound. Convergence time and performance bounds are derived in closed-forms. Numerical results confirm superior throughput performance of the proposed solution compared to existing approaches, and highlight the existence of a tradeoff between alignment overhead and achievable throughput that affects the optimal association.
  • Keywords
    "Optimization","Throughput","Array signal processing","Training","Antennas","Convergence","Radio frequency"
  • Publisher
    ieee
  • Conference_Titel
    Research and Technologies for Society and Industry Leveraging a better tomorrow (RTSI), 2015 IEEE 1st International Forum on
  • Type

    conf

  • DOI
    10.1109/RTSI.2015.7325078
  • Filename
    7325078