Title :
A flexible top metal structure to improve ultra low-k reliability
Author :
K. F. Cheng;C. L. Teng;H. Y. Huang;H. C. Chen;C. W Shih;T. H. Liu;C. H. Tsai;C. W. Lu;Y. H. Wu;H. H. Lee;M. H. Lee;M. H. Hsieh;B. L. Lin;S. Y Hou;C. J. Lee;H. H. Lu;T. I. Bao;S. L. Shue;C. H. Yu
Author_Institution :
Taiwan Semiconductor Manufacturing Company 168, Park Ave. 2, HsinChu Science Park, HsinChu, Taiwan 308-44, R.O.C.
fDate :
5/1/2015 12:00:00 AM
Abstract :
High stresses generated from chip-package interactions (CPI), especially when large die is flip mounted on organic substrate using Pb-free C4 bumps, can easily cause low-k delamination. A novel scheme by applying an elastic material can effectively reduce the transmitted stresses and, thus, resolve the interfacial delamination issue. Along with an optimized chip-package integration solution, a reliable interconnect structure with good electrical performance, has been successfully demonstrated.
Keywords :
"Decision support systems","Lead","Packaging","Microelectronics","Reliability"
Conference_Titel :
Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International
Electronic_ISBN :
2380-6338
DOI :
10.1109/IITC-MAM.2015.7325587
