Title :
Compact model for solder bump electromigration failure
Author :
H. Ceric;S. Selberherr
Author_Institution :
Institute for Microelectronics, TU Wien Guß
fDate :
5/1/2015 12:00:00 AM
Abstract :
The mechanical and electrical properties of solder bumps influence the overall reliability of 3D ICs. In this paper we present a compact model for prediction of the mean-time-to-failure of solder bumps under the influence of electromigration.
Keywords :
"Stress","Mathematical model","Electromigration","Current density","Reliability","Adaptation models","Semiconductor process modeling"
Conference_Titel :
Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International
Electronic_ISBN :
2380-6338
DOI :
10.1109/IITC-MAM.2015.7325651
