DocumentCode :
3691318
Title :
Non-contact carrier density measurement of semiconductor wafers by terahertz spectroscopic ellipsometry
Author :
T. Yamashita;M. Suga;T. Okada;A. Irisawa;M. Imamura
Author_Institution :
ADVANTEST Corporation, 48-2 Matsubara, Kamiayashi, Aoba-ku, Sendai, Miyagi 989-3124, Japan
fYear :
2015
Firstpage :
1
Lastpage :
2
Abstract :
We developed a terahertz ellipsometry system that can measure the complex dielectric characteristics of doped semiconductors and evaluate the carrier density and mobility in a non-destructive, non-contact way. The system is constructed of optical-fiber pigtail-coupled terahertz emitter and detector, and delivers high measurement precision and stability. We demonstrated carrier-density measurement of n-type GaAs wafer and n-type SiC epitaxial film using this system, and confirmed a good agreement with conventional measurement methods.
Keywords :
"Semiconductor device measurement","Dielectric measurement","Optical variables measurement","Charge carrier density","Silicon carbide","Optical films"
Publisher :
ieee
Conference_Titel :
Infrared, Millimeter, and Terahertz waves (IRMMW-THz), 2015 40th International Conference on
ISSN :
2162-2027
Electronic_ISBN :
2162-2035
Type :
conf
DOI :
10.1109/IRMMW-THz.2015.7327471
Filename :
7327471
Link To Document :
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