DocumentCode :
3691933
Title :
Six sigma approach of understanding and resolving skip ink issue
Author :
Wiljelm Carl K. Olalia
Author_Institution :
ON Semicond. Philippines Inc., Cavite, Philippines
fYear :
2015
Firstpage :
1
Lastpage :
4
Abstract :
Both Internal and External customer is directly affected by the skip ink issue. External costumer that received un-ink electronically die will generate IFAR while internal costumer is mandated to perform re-working that affecting the delivery and cycle time of the product.
Keywords :
"Ink","Assembly","Solenoids","Viscosity","Structural rings","Accuracy","Six sigma"
Publisher :
ieee
Conference_Titel :
Joint e-Manufacturing and Design Collaboration Symposium (eMDC) & 2015 International Symposium on Semiconductor Manufacturing (ISSM), 2015
Type :
conf
Filename :
7328872
Link To Document :
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