Title :
Highly effective and high throughput chipping monitor to prevent wafer cracking
Author :
C H Yen;Y L Fu;T S Lee;H T Lo;J Y Chang;Tim Peng;Henry Chen;Ray Huang
Author_Institution :
Taiwan Semiconductor Manufacturing Company(tsmc), 8, Li-Hsin Rd. 6, Hsinchu Science Park, Hsinchu 300-78, Taiwan, R.O.C.
Abstract :
During semiconductor manufacturing processes, wafer cracking inside a tool is a very serious problem in a fab. It results in costs from tool recovery, wafer and time loss, and potential contamination for other wafers. Most wafer cracking cases result from wafer edge chipping. A good chipping monitor solution will save more than 100 times the costs related to wafer cracking cases.
Keywords :
"Monitoring","Inspection","Image edge detection","Throughput","Manufacturing","Contamination","Yield estimation"
Conference_Titel :
Joint e-Manufacturing and Design Collaboration Symposium (eMDC) & 2015 International Symposium on Semiconductor Manufacturing (ISSM), 2015
