DocumentCode :
3693652
Title :
dsReliM: Power-constrained reliability management in Dark-Silicon many-core chips under process variations
Author :
Mohammad Salehi;Muhammad Shafique;Florian Kriebel;Semeen Rehman;Mohammad Khavari Tavana;Alireza Ejlali;Jörg Henkel
Author_Institution :
ESRLab, Department of Computer Engineering, Sharif University of Technology, Tehran, Iran
fYear :
2015
Firstpage :
75
Lastpage :
82
Abstract :
Due to the tight power envelope, in the future technology nodes it is envisaged that not all cores in a many-core chip can be simultaneously powered-on (at full performance level). The power-gated cores are referred to as Dark Silicon. At the same time, growing reliability issues due to process variations and soft errors challenge the cost-effective deployment of future technology nodes. This paper presents a reliability management system for Dark Silicon chips (dsReliM) that optimizes for reliability of on-chip systems while jointly accounting for soft errors, process variations and the thermal design power (TDP) constraint. Towards the TDP-constrained reliability optimization, dsReliM leverages multiple reliable application versions that can potentially execute on different cores with frequency variations and supporting differenst voltage-frequency levels, thus facilitating distinct power, reliability and performance tradeoffs at run time. Experiments show that our dsReliM system provides up to 20% reliability improvements under different TDP constraints when compared to a state-of-the-art technique. Also, compared to an ideal-case optimal solution, dsReliM deviates up to 2.5% in terms of reliability efficiency, but speeds up the reliability management decision time by a factor of up to 3100.
Keywords :
"Software reliability","Software","Silicon","Timing","Management","Transient analysis"
Publisher :
ieee
Conference_Titel :
Hardware/Software Codesign and System Synthesis (CODES+ISSS), 2015 International Conference on
Type :
conf
DOI :
10.1109/CODESISSS.2015.7331370
Filename :
7331370
Link To Document :
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