DocumentCode
3694822
Title
Sustaining the silicon revolution: From 3-D transistors to 3-D integration
Author
Tsu-Jae King Liu;Peng Zheng;Daniel Connelly;Kimihiko Kato;Robert Nguyen;Chuang Qian;Alexis Peschot
Author_Institution
Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA 94720-1770 USA
fYear
2015
Firstpage
1
Lastpage
3
Abstract
Technological pathways for sustaining continual improvement in silicon integrated-circuit “chip” functionality at ever lower cost and energy per function, toward the vision of the Internet of Everything, are discussed.
Keywords
"Logic gates","FinFETs","Silicon","Relays","CMOS integrated circuits"
Publisher
ieee
Conference_Titel
SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2015 IEEE
Type
conf
DOI
10.1109/S3S.2015.7333479
Filename
7333479
Link To Document