DocumentCode
3695645
Title
Design and simulation of power divider/combiner on wafer in W-band
Author
Liu Zi-yi;Lv Xin;Yu Wei-hua;Yang Wen-tao;Yang Jian-hong
Author_Institution
Institute of Microelectronics, Lanzhou University, China
fYear
2015
fDate
6/1/2015 12:00:00 AM
Firstpage
1349
Lastpage
1352
Abstract
In this paper, a 110GHz power divider/combiner based on microstrip branch-line hybrid is proposed, which can form a power splitting/combining network. This quadrature hybrid has the properties of low loss, equal power splitting, mature microstripprocessing technology, especially can be tested on chip. In the whole band(105GHz∼115GHz), the 3D EM simulation results show that the return loss is less than-19.78dB (−34.49dB at 110GHz); between the outputs, the magnitude difference is less than 0.05, while the phase difference is less than 0.3°, also the output isolation is more than 19.94dB (35.06dB at 110GHz). Integrated with MMIC power amplifiers, this divider/combiner can be widely used in W band power combining systems.
Keywords
"Microstrip","Ports (Computers)","Hybrid power systems","Simulation","Solid modeling","Yttrium","Microwave amplifiers"
Publisher
ieee
Conference_Titel
Industrial Electronics and Applications (ICIEA), 2015 IEEE 10th Conference on
Type
conf
DOI
10.1109/ICIEA.2015.7334318
Filename
7334318
Link To Document