Title :
3D advanced integration technology for heterogeneous systems
Author :
Pascal Vivet;Christian Bernard;Fabien Clermidy;Denis Dutoit;Eric Guthmuller;Ivan-Miro Panadès;G. Pillonnet;Yvain Thonnart;Arnaud Garnier;Didier Lattard;Amandine Jouve;Franck Bana;Thierry Mourier;Séverine Chéramy
Author_Institution :
Univ. Grenoble Alpes, CEA, LETI, MINATEC Campus, 38054, France
Abstract :
3D integration technology is nowadays mature enough, offering today further system integration using heterogeneous technologies, with already many different industrial successes (Imagers, 2.5D Interposers, 3D Memory Cube, etc.). CEA-LETI has been developing for a decade 3D integration, and have pursued research in both directions: developing advanced 3D technology bricks (TSVs, µ-bumps, Hybrid Bonding, etc), and designing advanced 3D circuits as pioneer prototypes. In this paper, a short overview of some recent advanced 3D technology results is presented, including some latest 3D circuit´s description.
Keywords :
"Three-dimensional displays","Artificial intelligence","Stacking","Semiconductor device reliability","Thermal management"
Conference_Titel :
3D Systems Integration Conference (3DIC), 2015 International
DOI :
10.1109/3DIC.2015.7334468
