Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement

This paper is dedicated to the full integration of innovative silicon-based material for Wafer-Level molding of silicon interposer wafers. This technology can be used in the frame of silicon packages where the silicon interposer is either reported on P-BGA or directly assembled on board. Interest of such material, is the rapid Wafer-Level lamination process and die planarization which can facilitate interposer realization. In a first part of the article, we have evaluated the compatibility of this material with the whole interposer flow by having a focus on filling capacities as well as induced deformation on 300mm wafers. Secondly, we have generated electrical test vehicles in order to verify the impact of such material on environmental and mechanical reliability.