• DocumentCode
    3695876
  • Title

    Nano-Function materials for TSV technologies

  • Author

    Hiroaki Ikeda;Shigenobu Sekine;Ryuji Kimura;Koichi Shimokawa;Keiji Okada;Hiroaki Shindo;Tatsuya Ooi;Rei Tamaki;Makoto Nagata

  • Author_Institution
    Napra Corporation, Katsushika-ku, Tokyo, 124-0013, Japan
  • fYear
    2015
  • Abstract
    This paper discloses that Nano-Function materials make TSV structure by printing technologies without CVD/PVD/Plating. For isolation layer forming, two types of TSV pattern had been examined. For metal fill, we adopted conductive paste or alloy plate contains nanomized alloys (Cu, Sn and additives) to fill via by less than 250°C condition. Re-melting temperature of the alloy is more than 300°C.
  • Keywords
    "Metals","Printing","Plating","Wiring"
  • Publisher
    ieee
  • Conference_Titel
    3D Systems Integration Conference (3DIC), 2015 International
  • Type

    conf

  • DOI
    10.1109/3DIC.2015.7334569
  • Filename
    7334569
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3695876