Title :
Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC
Author :
Sumin Choi; Heegon Kim;Daniel H. Jung;Jonghoon J. Kim; Jaemin Lim; Hyunsuk Lee; Kyungjun Cho; Joungho Kim; Hyungsoo Kim; Yongju Kim; Yunsaing Kim
Author_Institution :
Department of Electrical Engineering, TERA Lab, Korea Advanced Institute of Science and Technology, Daejeon, South Korea
Abstract :
In this paper, crosstalk-included eye-diagram of high-speed interposer channels are estimated and investigated. To analyze the crosstalk effect of various interposer channels, silicon, organic, and glass substrates are compared under the same physical structure and dimensions. Moreoever, crosstalk-included eye-diagrams are estimated in short time with high accuracy using 8 worst input cases. The estimated crosstalk-included eye-diagrams are analyzed at data rate of 1 and 2 Gbps.
Keywords :
"Crosstalk","Silicon","Glass","Receivers","Conductivity"
Conference_Titel :
3D Systems Integration Conference (3DIC), 2015 International
DOI :
10.1109/3DIC.2015.7334595
