Cost modeling and analysis for the design, manufacturing and test of 3D-ICs

In the last years 3D-Integration has emerged as one possible solution to develop heterogeneous systems with a preferably low feature-size. Along with the variety of possibilities on how to vertically integrate two or more dies, many aspects including design, choice of technology and cost have to be considered. The increase of complexity emphasizes the need to consider technology and test issues already at the design stage. Going along with this, economical aspects have to be regarded as well to be able to decide the feasibility of the system at the beginning of the development process. Therefore, first domains that generate cost are named and analyzed. After that, this paper proposes comprehensive cost modeling for 3D-ICs, which covers the whole production chain from the design stage to final test. The cost model has been implemented in the tool COMOA-3D which is able to analyze the costs of the different parts and to compare different process and test flows, which can be imported into the tool.