Title :
Power tile optimization and packaging for efficient temperature management of ASIC´s in networking applications
Author :
Susheela Narasimhan
Author_Institution :
Juniper Networks Inc., Sunnyvale, CA, USA
Abstract :
The document was not made available for publication as part of the conference proceedings.
Conference_Titel :
3D Systems Integration Conference (3DIC), 2015 International
DOI :
10.1109/3DIC.2015.7334607
