DocumentCode :
3695924
Title :
Temperature-aware online testing of power-delivery TSVs
Author :
Hua-Cheng Fu;Shi-Yu Huang;Ding-Ming Kwai;Yung-Fa Chou
Author_Institution :
EE Dept., National Tsing Hua University, Taiwan
fYear :
2015
Abstract :
A latent defect in a power-delivery TSVs in a 3D IC could cause power glitches under a heavy workload in the field and thereby leading to timing failure. In order to catch these defects before they actually strikes, on-line ring-oscillator based VDD-drop monitoring schemes have been proposed previously. However, these methods have not taken into account the effect of the temperature, which could affect their accuracy in the final VDD prediction. In this paper, we present a temperature-aware test method for power-delivery TSVs, with several features - including a process-calibration scheme and a temperature-aware worst-case VDD prediction scheme. Based on the these schemes, the pass-or-fail decision on the quality of a power-TSV can be made more accurately.
Keywords :
Through-silicon vias
Publisher :
ieee
Conference_Titel :
3D Systems Integration Conference (3DIC), 2015 International
Type :
conf
DOI :
10.1109/3DIC.2015.7334617
Filename :
7334617
Link To Document :
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