Residual Stress Distributions Based on Solder Joint Shape with Free Boundaries

Whether low or high temperature brazing seal structure, the solder joint shapes are important concern for the residual stress distributions. Many investigations of the residual stress distributions with the ideal solder joint shape in the brazing seal so far have been carried out theoretically and experimentally, whereas ones of the residual stress distributions with actual solder joint shape in these seal systems are rarely performed. In order to more accurately understand characteristics of the residual stress distributions within the brazing seal, computational fluid dynamics technique is used to predict the actual solder joint shape firstly. Furthermore, the residual stress distributions resulted from the actual solder solidification behavior in the taper configuration of the brazing seal are investigated by experimental observation and finite element method (FEM) simulation in this paper. Results gained show that the residual stress distributions occurred on the actual solder joint are more consistent with the experimental results than them generated on the ideal solder joint. The overall residual stresses are found to increase drastically near the welding interfaces.