A 47–217 GHz dynamic frequency divider in SiGe technology

A divide-by-2 dynamic frequency divider with a frequency operating range from 47 up to 217GHz, i.e. a bandwidth of 170GHz, in a 130nm SiGe BiCMOS process with cut-off frequency f_T =3D250 GHz is presented. To the best of authors´ knowledge, this is the highest operating frequency and bandwidth reported so far in silicon. The divider is based on the regenerative frequency division principle followed by a buffer that can deliver ~-12.5dBm output power (no probe or waveguide/cable loss correction) at 217 GHz input frequency, which is sufficient to drive succeeding stages. The divider´s correct functionality over its entire operating frequency range is verified with lab measurements.