• DocumentCode
    3701032
  • Title

    Flip-chip bonding of VCSELs to silicon grating couplers via SU8 prisms fabricated using laser ablation

  • Author

    K. S. Kaur;A. Z. Subramanian;R. Verplancke;P. Cardile;J. Van Kerrebrouck;S. Spiga;R. Meyer;J. Bauwelinck;R. Baets;G. Van Steenberge

  • Author_Institution
    Centre for Microsystems Technology, imec/Ghent University, B-9052 Gent, Belgium
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    We successfully demonstrate for the first time, VCSEL-to-silicon grating coupler flip-chip assembly using SU8 prism fabricated by non-uniform laser ablation. Excess loss of <; 1 dB and data transmission up to 20 Gb/s @ 1550 nm was achieved.
  • Keywords
    "Vertical cavity surface emitting lasers","Bonding","Assembly","Loss measurement","Flip-chip devices","Semiconductor device measurement","Couplings"
  • Publisher
    ieee
  • Conference_Titel
    Optical Communication (ECOC), 2015 European Conference on
  • Type

    conf

  • DOI
    10.1109/ECOC.2015.7341726
  • Filename
    7341726
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3701032