Title :
FPGA-Based Detailed Real-Time Simulation of Power Converters and Electric Machines for EV HIL Applications
Author :
Herrera, Luis ; Cong Li ; Xiu Yao ; Jin Wang
Author_Institution :
Dept. of Eletrical & Comput. Eng., Ohio State Univ., Columbus, OH, USA
Abstract :
Real-time (RT) simulation plays a fundamental role in the design and validation of hardware and software for power electronic converters and electric drives. In this paper, a field-programmable gate array (FPGA)-based RT platform for simulation of power converters and electric machines is presented. Strategies for modeling power electronic devices are explained and compared. In addition, a Thevenin-based equivalent model of a switch is enhanced to model the on characteristics of these devices. This motivates the design of an electrothermal algorithm for FPGA implementation. With respect to electric machines, different methods for modeling of the saturation characteristics are evaluated for their use in RT simulation. A procedure to efficiently compute the saturation characteristics is proposed. Finally, a hardware-in-the-loop model of an electric vehicle drive is used to illustrate the machine saturation.
Keywords :
electric drives; electric machines; electric vehicles; equivalent circuits; field programmable gate arrays; power convertors; EV HIL applications; FPGA-based RT simulation platform; Thevenin-based equivalent model; electric machine real-time simulation; electric vehicle drive; electrothermal algorithm; field programmable gate array implementation; hardware validation; hardware-in-the-loop model; power electronic converter real-time simulation; power electronic device; saturation characteristics; software validation; Computational modeling; Field programmable gate arrays; Induction machines; Insulated gate bipolar transistors; Mathematical model; Switches; AC machines; ac???dc power converters; dc???dc power converters; electric machines; electrothermal effects; vehicle dynamics;
Journal_Title :
Industry Applications, IEEE Transactions on
DOI :
10.1109/TIA.2014.2350074