Title :
Typical defects caused by untypical situations from assembling lines analysis
Author :
M. Branzei;I. Plotog;B. Marginean
Author_Institution :
Politehnica University of Bucharest, Romania
Abstract :
In the context of globalization, taking into account the assembling line in electronic industry movements to the central and east European countries, the continuous production costs reduction tendency and the difficulties to accomplish both financials respectively technical aspects of the business, untypical situations could be encountered with consequence over production quality and reliability. In the paper typical assembling defects are presented and the causes analyzed relating to the real situations encountered on assembling lines. The matters determined by the distances between local branches or /and between them and mother company, the electronic components and materials transfercircuit and quality, the delay between the local assembling processes problems and technical decisions at the mother company level were considered. The wave contaminations aspects will be also analyzed. Some solutions will be proposed based on the analyses.
Keywords :
"Context","Reliability","Electromigration","Metals"
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2015 IEEE 21st International Symposium for
DOI :
10.1109/SIITME.2015.7342297