High speed phase modulator driver unit in 55 nm SiGe BiCMOS for a single-channel 100 Gb/s NRZ silicon photonic modulator

In this paper, a silicon integrated driver unit, intended for a single-channel NRZ 3D heterogeneous silicon photonic modulator is proposed. It allows data rate of up to 100 Gb/s, which is beyond the current state of the art. It directly controls 160 GHz bandwidth high speed phase modulator (HSPM) segment of a Mach Zehnder Interferometer (MZI). It is fabricated in 55 nm SiGe BiCMOS technology with fT of up to 300 GHz. It features a 300 mW of dc power consumption and delivers a 2.5 Vpp single-ended output swing at 100 Gb/s.