DocumentCode
3706367
Title
TaOx -based ReRAM stack with NbOx -based selector for 3D cross-point ReRAM application
Author
Natsuki Fukuda;Yutaka Nishioka;Koukou Suu
Author_Institution
Institute of Semiconductor and Electronics Technologies, ULVAC, Inc., 1220-1 Suyama, Susono, Shizuoka, 410-1231, Japan
fYear
2014
fDate
6/1/2014 12:00:00 AM
Firstpage
1
Lastpage
2
Abstract
To achieve a high-density integration of non-volatile memory, NbOx selector-cell prepared by a sputtering process is developed for cross-point 3D-ReRAM. By optimizing sputtering conditions, NbOx film with a threshold voltage of ±0.5V is obtained as a bidirectional selector. Furthermore, ReRAM with a stack of NbOx selector-cells is confirmed to have a good switching property at the threshold voltage of ±0.5V.
Keywords
"Films","Sputtering","Threshold voltage","Switches","Voltage measurement","Oxygen","Conductivity"
Publisher
ieee
Conference_Titel
Silicon Nanoelectronics Workshop (SNW), 2014 IEEE
Print_ISBN
978-1-4799-5676-0
Type
conf
DOI
10.1109/SNW.2014.7348604
Filename
7348604
Link To Document