Methodology for improved cell integration based on distributed-element circuit analysis

Improved cell integration is a critical part of narrowing the gap between cell and module efficiencies. In this paper, we present a methodology based distributed-element circuit analysis and electroluminescence imaging for optimizing the design of solar cell metallization and interconnection. The distributed-element circuit model is based on an array of equivalent circuits, each representing a 100×100 μm area of a thin film solar cell. A range of cell metallization designs are then compared within the simulation framework to deliver predictions of the effect of design changes on module efficiency. The optimized cell metallization design was tested experimentally on the manufacturing line, confirming the anticipated improvement in module efficiency. Distributed-element circuit analysis delivers reliable predictions of module efficiency and accelerates cell integration development projects.