Title :
Characterization and Modeling of the Conducted Emission of Integrated Circuits Up To 3 GHz
Author :
Berbel, Nestor ; Fernandez-Garcia, Raul ; Gil, Iñigo
Author_Institution :
Dept. of Electron. Eng., Univ. Politec. de Catalunya, Terrassa, Spain
Abstract :
In this paper, an electrical model in order to predict the electromagnetic compatibility (EMC) conducted emission of integrated circuits (ICs) up to 3 GHz is presented. The electrical model predicts the behavior of the propagation paths of electromagnetic conducted emissions at high frequency by including all distributed effects and capacitive and inductive couplings. The proposed model has been compared with the standard IC emission model (ICEM-CE) to predict the EMC of a clock generator by means of the feature selective validation (FSV) method. The results show that the proposed model can expand the frequency range up to 3 GHz with a high degree of accuracy. Moreover, an alternative approach to model the electromagnetic noise that is based on the analysis of its spectral components is proposed.
Keywords :
UHF integrated circuits; electromagnetic compatibility; microwave integrated circuits; EMC prediction; FSV method; ICEM-CE; capacitive couplings; clock generator; distributed effects; electrical model; electromagnetic compatibility; electromagnetic conducted emissions; electromagnetic noise; feature selective validation method; inductive couplings; integrated circuits; propagation paths; spectral components; standard IC emission model; Electromagnetic compatibility; Impedance; Integrated circuit modeling; Predictive models; Standards; Transmission line measurements; Conducted emissions; IC emission model (ICEM-CE); electromagnetic compatibility (EMC); feature selective validation (FSV); integrated circuit (IC); internal activity (IA);
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2013.2294256