• DocumentCode
    3711893
  • Title

    4th generation infrared detectors and focal plane arrays

  • Author

    Sanjay Krishna

  • Author_Institution
    Center for High Technology Materials, Department of Electrical and Computer Engineering, University of New Mexico, Albuquerque, United States of America
  • fYear
    2015
  • Firstpage
    44
  • Lastpage
    45
  • Abstract
    Infrared imaging (3-25μm) has been an important technological tool for the past sixty years since the first report of infrared detectors in 1950s. The ability to detect the temperature of a scene from the blackbody radiation that it emits has spawned applications in a wide variety of fields ranging from defense and security to non-invasive medical diagnostics and remote sensing. However, IR imaging landscape has dramatically changed in the past decade. Firstly, the cost of lower end imagers has been steadily declining (30% every year since 2005) enabling them to be mounted on dashboards of automobiles including Audis and BMWs. Secondly, advent of novel antimonide based semiconductor technology has dramatically improved the performance of higher end imagers that are used for military, defense and security applications. There has been a dramatic progress in the development of infrared detectors in the past decade with new materials like InAsSb, InAs/GaSb superlattices and InAs/InAsSb superlattices. However, in spite of dramatic technological progress, there are a lot of unknowns in these materials. For instance, the background concentration, vertical mobility, diffusion constants etc for these systems are largely unknown or are very difficult to measure accurately. The GaSb conducting substrate coupled with anisotropic transport and quantum transport makes the investigating of this system challenging.
  • Keywords
    "Infrared detectors","Superlattices","Infrared imaging","Substrates","Security","Medical diagnostic imaging"
  • Publisher
    ieee
  • Conference_Titel
    Avionics and Vehicle Fiber-Optics and Photonics Conference (AVFOP), 2015 IEEE
  • Type

    conf

  • DOI
    10.1109/AVFOP.2015.7356643
  • Filename
    7356643