Title :
A high-density 300-Gbit/s parallel optical interconnect module with efficient optical sub-assembly techniques
Author :
Yasunobu Matsuoka; Yong Lee;Hideo Arimoto;Toshiaki Takai;Norio Chujo;Naoki Matsushima;Masataka Sato;Shinji Komatsuzaki;Akira Ogura;Kinya Yamazaki;Yoshinori Sunaga
Author_Institution :
Research & Development Group, Center for Technology Innovation - Electronics, Hitachi, Ltd., Kokubunji, Japan
Abstract :
A high-density 300-Gbit/s (25-Gbit/s × 12-ch) parallel optical-interconnect module (OIM) was fabricated by using an efficient, newly developed optical sub-assembly (OSA) techniques. The OIM module provides high heat dissipation and high optical-coupling efficiency. Furthermore, the fabricated OIM successfully demonstrated 25-Gbit/s error-free multimode transmission.
Keywords :
"Optical device fabrication","Integrated optics","Optical transmitters","High-speed optical techniques","Optical receivers","Adaptive optics"
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2015 IEEE
Print_ISBN :
978-1-4799-8814-3
DOI :
10.1109/ICSJ.2015.7357344
