• DocumentCode
    3712567
  • Title

    A high-density 300-Gbit/s parallel optical interconnect module with efficient optical sub-assembly techniques

  • Author

    Yasunobu Matsuoka; Yong Lee;Hideo Arimoto;Toshiaki Takai;Norio Chujo;Naoki Matsushima;Masataka Sato;Shinji Komatsuzaki;Akira Ogura;Kinya Yamazaki;Yoshinori Sunaga

  • Author_Institution
    Research & Development Group, Center for Technology Innovation - Electronics, Hitachi, Ltd., Kokubunji, Japan
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A high-density 300-Gbit/s (25-Gbit/s × 12-ch) parallel optical-interconnect module (OIM) was fabricated by using an efficient, newly developed optical sub-assembly (OSA) techniques. The OIM module provides high heat dissipation and high optical-coupling efficiency. Furthermore, the fabricated OIM successfully demonstrated 25-Gbit/s error-free multimode transmission.
  • Keywords
    "Optical device fabrication","Integrated optics","Optical transmitters","High-speed optical techniques","Optical receivers","Adaptive optics"
  • Publisher
    ieee
  • Conference_Titel
    CPMT Symposium Japan (ICSJ), 2015 IEEE
  • Print_ISBN
    978-1-4799-8814-3
  • Type

    conf

  • DOI
    10.1109/ICSJ.2015.7357344
  • Filename
    7357344
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3712567